Polycrystalline diamond cutting tool and method of manufacturing the same
US5366522A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 3, 1992 |
| Grant date | Nov 22, 1994 |
| Priority date | — |
| Expiry date | Nov 3, 2012 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2237/82
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A polycrystalline diamond cutting tool comprises a tool material of polycrystalline diamond formed by low-pressure vapor deposition, which is bonded to a shank of cemented carbide through a brazing layer. The thickness of the polycrystalline diamond layer is set at 0.1 to 1.0 mm, while that of the brazing layer is set at 10 to 50 .mu.m. The brazing layer is made of a material having a melting point of 950.degree. to 1300.degree. C., which is in the form of an alloy layer containing at least one material selected from metals belonging to the groups IVa, Va, VIa and VIIa of the periodic table and carbides thereof and at least one material selected from Au, Ag, Cu, Pt, Pd and Ni. The polycrystalline diamond cutting tool is improved in heat resistance and tool strength. In order to improve deposition resistance of the cutting tool, the surface roughness of a tool rake face is set to be not more than 0.2 .mu.m in Rmax. A portion of the polycrystalline diamond layer up to a depth of 10 .mu.m from the rake face contains 99 to 100 atomic percent of carbon elements, and 99 to 100% of carbon atoms are diamond-bonded. A surface of the polycrystalline diamond layer which has been in contact wi…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.