Patent · US Expired

UV-curable adhesive semiconductor chip mounting process

US5366573A · kind A · utility

28Cited by

8References

6Claims

0Family size

Assignee

Siemens Nixdorf Informationssysteme AG · DE

Inventors

Heiner Bayer · Olching, DE
Barbara Lehner · Munich, DE
Oskar Wirbser · Germering, DE
Gregor Unger · Germering, DE

Key dates

Filing date	Aug 24, 1993
Grant date	Nov 22, 1994
Priority date	—
Expiry date	Aug 24, 2013

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19042
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Assembly of semiconductor chips is accomplished using an acrylate-based adhesive which can be cured rapidly by UV light and which gives an adhesive bond that is resistant to soldering by can be readily removed by solvents after soldering. During assembly, the back sides of the semiconductor chips are bonded to a temporary carrier by the adhesive and adjusted to the proper mirror image position on the carrier before the adhesive is cured. The chip array is then soldered on a component and the temporary carrier is removed from the chips by a solvent.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.