Process for thermal debinding and sintering of a workpiece
US5366679A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 27, 1992 |
| Grant date | Nov 22, 1994 |
| Priority date | — |
| Expiry date | May 27, 2012 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F2998/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A process for thermal debinding and sintering of a workpiece made by molding a mixture of a binder and a powder, the process entailing the steps of injection molding a workpiece entailing at least 30% vol. of binder, the binder containing from about 70% to about 90% wt. of at least one wax and from about 10% to 30% wt. of high molecular weight polymer, introducing the molded workpiece in an enclosure at ambient temperature, injecting an atmosphere of at least 95% vol. hydrogen and less than 5% vol. water vapor, heating the enclosure and/or the workpiece until reaching a temperature between about 150.degree. C. to about 200.degree. C., maintaining the temperature during a period of time sufficient to substantially decompose all the waxes in the binder, then heating again the enclosure and/or the workpiece to reach a temperature of about 700.degree. C. while substantially eliminating the rest of the binder, maintaining the temperature until the workpiece is substantially sintered, cooling the enclosure and the workpiece to reach a temperature where no substantial oxidation can occur, then withdrawing the workpiece from the enclosure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.