Infrared detector devices and their manufacture
US5367166A · kind A · utility
6Cited by
1References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 15, 1993 |
| Grant date | Nov 22, 1994 |
| Priority date | — |
| Expiry date | Mar 15, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/20
Abstract
Compact electrical connections (4) are formed on side-walls (1) of an infrared detector element having a step structure (1 to 3) over which a conductive layer (40) is deposited. Using a directional etching treatment, such as ion milling, the conductive layer (40) is removed from at least the bottom (3) of the step structure but is left lining the side-wall (1) as the connection (4). This permits formation of connections (4 and 44) in compact dense arrays, including plural-wavelength arrays in stacked bodies (10 and 20) on a circuit substrate (30).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.