Method and apparatus for applying solder flux to a printed circuit
US5368219A · kind A · utility
13Cited by
7References
44Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 4, 1993 |
| Grant date | Nov 29, 1994 |
| Priority date | — |
| Expiry date | Nov 4, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3489
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Apparatus and methods for a system and process for applying a flux coating to a circuit board by pulsing an airless spray gun on and off to achieve excellent circuit board through-hole penetration and uniform film thickness. An overspray collection system is provided which reduces overspray and increases material utilization and transfer efficiency. A gun positioning mechanism, which can be automated, accurately locates the gun relative to the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.