Water-soluble, film-forming inorganic compounds, fireproof and fire-resistance composites and fire-resistance, flexible, sheet composite covering materials formed by the use of the compounds, and fire-resistance-covering process
US5368950A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 25, 1993 |
| Grant date | Nov 29, 1994 |
| Priority date | — |
| Expiry date | May 25, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2111/50
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Water-soluble film-forming inorganic compounds having a specific gravity of 1.1 or more and capable of being formed into a film at ordinary temperature or by heating. The compounds are formed by a reaction of a metal, a hydroxide of an alkali metal, and hydrofluoric acid or boric acid and their salts or their submineral acid salts. The water-soluble film-forming inorganic compounds are superior in refractory, heat-resistant and heat-insulating properties, also have rust-inhibitory properties. The compounds are useful as heat-resistant adhesives in fireproof and heat-resistant layered composites made of metal, wood, and the like. A process of coating materials with a layer of these compounds is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.