Method of mounting a semiconductor device to a heat sink
US5369879A · kind A · utility
12Cited by
30References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 19, 1993 |
| Grant date | Dec 6, 1994 |
| Priority date | — |
| Expiry date | Apr 19, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53183
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of mounting a semiconductor device to a heat sink where an opening in the circuit board is formed and sized to allow the semiconductor device to pass therethrough, where a heat sink is positioned on one side of the circuit board and a load is introduced on a second side of the circuit board and applied to the semiconductor device forcing it against the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.