Method for forming solder deposit on a substrate
US5369880A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 6, 1993 |
| Grant date | Dec 6, 1994 |
| Priority date | — |
| Expiry date | May 6, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic circuit assembly (100) includes a circuit carrying substrate (150) on which electrical components (130) are mounted using solder deposits (125) having an essentially planar surface. A solder deposit (125) is created by forming a recess (155) in the substrate (150), providing a metallic pad (110) about the recess (155), depositing solder paste (120) on the metallic pad (110), and reflowing the solder paste (120) on the metallic pad (110). The electronic circuit (100) is assembled by placing electrical components (130) on the substrate (150) having solder deposits (125), and by further reflowing the solder deposits (125) on the metallic pad (110).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.