Dispersion-based heat-sealable coating
US5371118A · kind A · utility
2Cited by
5References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 17, 1992 |
| Grant date | Dec 6, 1994 |
| Priority date | — |
| Expiry date | Nov 17, 2012 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J175/04
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention is a two-component film-forming reactive system for heat-sealable materials. The composition contains at least one resin which is curable with an epoxide and an epoxide compound as a curing agent. The resin which is curable with the epoxide is a mixture of a carboxyl or hydroxyl terminated polyurethane with an acrylate or methacrylate polymer or copolymer having hydroxyl or carboxyl groups.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.