Resin composition and process for producing the composition
US5371152A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 8, 1992 |
| Grant date | Dec 6, 1994 |
| Priority date | — |
| Expiry date | Oct 8, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/906
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The resin composition comprises, as essential components, (A) an epoxy resin, (B) a thermoplastic resin and (C) particles of a diaminodiphenylsulfone compound whose cross linking reactivity with the epoxy resin is prevented until the resin composition is subjected to molding or curing by a resin coating which is formed (i) by forming or adhering resin particles onto the surface of the diaminodiphenylsulfone particles or (ii) by forming a resin film on the diaminodiphenylsulfone particles, the coating resin used for forming the resin coating is not compatible with components included in the resin composition at the temperature up to the curing temperature of the resin composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.