Thermally conductive integrated circuit package with radio frequency shielding
US5371404A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 4, 1993 |
| Grant date | Dec 6, 1994 |
| Priority date | — |
| Expiry date | Feb 4, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device package comprises a substrate (10), a flip-chip (16), an underfill adhesive (25), and a thermally and electrically conductive plastic material (20). A leadless circuit carrying substrate has a metallization pattern (13) on a first side (15), one portion of the metallization pattern being a circuit ground (17). The second side has an array of surface mount solder pads (24) electrically connected to the metallization pattern by means of at least one conductive via (26) through the substrate. A semiconductor device (16) is flip-chip mounted to the metallization pattern by means of metal bumps (22). An underfill adhesive (25) fills the gap between the semiconductor device and the substrate. A thermally and electrically conductive plastic material (20) containing metal particles is transfer molded to encapsulate the semiconductor device, the underfill adhesive, and a portion of the first side of the leadless circuit carrying substrate, forming a cover. The conductive plastic material is electrically connected to the circuit ground to shield the semiconductor device from radio frequency energy, and is mechanically attached to the semiconductor device to dissipate h…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.