Resin molded type semiconductor device having a conductor film
US5371411A · kind A · utility
26Cited by
15References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 7, 1993 |
| Grant date | Dec 6, 1994 |
| Priority date | — |
| Expiry date | Jun 7, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A resin molded type semiconductor device has a metallic guard ring that is formed to cover the peripheral edge of the surface of a tetragonal semiconductor substrate. In order to prevent a passivation film on the guard ring from being cracked by stresses due to a resin mold package concentrating in the four corners of the semiconductor substrate, slits or rows of small holes are formed in the corner portions of the guard ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.