Spring clamp assembly with electrically insulating shoe
US5371652A · kind A · utility
45Cited by
8References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 5, 1994 |
| Grant date | Dec 6, 1994 |
| Priority date | — |
| Expiry date | Apr 5, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A spring clamp and insulating shoe assembly is used to secure a finned heat sink to an electronic device package. The spring clamp body fits between or around fins or pins extending from one face of a heat sink and carries an insulating shoe which fits around the edge of the device package and has a lip which engages the opposite face of the device package to urge the device package and heat sink into mutual contact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.