Method of packaging and assembling opto-electronic integrated circuits
US5371822A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 22, 1994 |
| Grant date | Dec 6, 1994 |
| Priority date | — |
| Expiry date | Mar 22, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of constructing opto-electronic integrated circuit packages passively aligns optical fibers inserted through holes in a package lid which are arranged in a pattern which corresponds with the pattern of emitters and receivers on a circuit die. When the lid is aligned with a package base to which the die is attached at a predetermined location, the fibers simultaneously couple to the emitters and receivers. The package components are each formed with alignment indicators. To assemble the packages, the alignment indicators are optically aligned to orient the components properly and the components are positioned such that centers of particular indicators are in predetermined positions relative to the centers other indicators. The components are then held in position while an affixation process secures them in place. Before the lid is secured to the base, a laser drills optic fiber holes to precise sizes in an array which corresponds with the locations of emitters and receivers on the die. The holes are sized differently for fibers associated with emitters and fibers associated with receivers. The fibers associated with emitters have core diameters which are a predetermined num…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.