Method for determining thickness of chemical vapor deposited layers
US5372645A · kind A · utility
3Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 17, 1993 |
| Grant date | Dec 13, 1994 |
| Priority date | — |
| Expiry date | Nov 17, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/045
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The thickness of a layer of material deposited by chemical vapor deposition, especially a diamond layer, is monitored by providing at least one substrate on which the material is deposited, with at least one perforation of a predetermined size therein. The relationship between the thickness of the layer formed in said perforation and the thickness of the layer formed on the substrate surface is determined, so that the thickness of the surface layer can be determined from the thickness of the layer formed in the perforation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.