Solder reflow mounting board
US5373113A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 29, 1993 |
| Grant date | Dec 13, 1994 |
| Priority date | — |
| Expiry date | Apr 29, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/047
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for reflow mounting an electronic component includes coating a terminal electrode on a mounting board with a second solder having a second melting point higher than a reflow temperature, placing the mounting board with the electronic component on a mounting land on a conveyor which may be brought into contact with the second solder on the terminal electrode, and heating the mounting board to the reflow temperature. The terminal electrode may be coated with a solder repelling material at a selected dividing area effective for dividing the terminal electrode into a plurality of sections substantially isolated from each other in terms of solder flow. Alternatively, a mounting jig may be used for supporting the mounting board without bringing the second solder on the terminal electrode into contact with the mounting jig.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.