Method and apparatus for winding substrates that are capable of being wound
US5374006A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 24, 1993 |
| Grant date | Dec 20, 1994 |
| Priority date | — |
| Expiry date | Feb 24, 2013 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65H2301/522
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A substrate capable of being wound is transported to a substrate carrier and wound onto the latter. For that purpose the substrate is first held in a defined storage position. With the substrate in that storage position the substrate carrier is moved into a threading position and brought into engagement with the substrate. The substrate is then automatically threaded around the substrate carrier. When the threading operation is complete, the substrate carrier is moved into a winding position in which the substrate is wound onto the substrate carrier. The rate of feed at which the substrate is transported by a motor to the substrate carrier is regulatable. The substrate carrier is motor-driven in a controllable manner, at a uniform torque and in dependence on the feed rate at which the substrate is transported to the substrate carrier. When the winding operation is complete the substrate is cut and the end of the substrate belonging to the winding is automatically fixed to the winding, while the other end of the substrate is again held in the defined storage position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.