Electroplating process and composition
US5374346A · kind A · utility
19Cited by
2References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 9, 1993 |
| Grant date | Dec 20, 1994 |
| Priority date | — |
| Expiry date | Aug 9, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0353
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process of electroplating comprising formation of a semiconductive coating over an article having both metallic and non-metallic portions, dissolving the metal surface underlying the semiconductive coating and removing the semiconductive coating by a high pressure water spray. The process is useful for the formation of printed circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.