Flexible printed substrate
US5374469A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 17, 1992 |
| Grant date | Dec 20, 1994 |
| Priority date | — |
| Expiry date | Sep 17, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible printed substrate imparted with an adhesive property for loading on an external substrate, a double printed substrate having formed on both surfaces thereof a metal layer or a wiring circuit, and a multilayer substrate having a multilayer structure are disclosed. The flexible printed substrate comprises an insulating resin layer comprising a low-linear expansion polyimide resin layer and a thermoplastic polyimide resin layer, and a metal layer or a wiring circuit formed on the low-linear expansion polyimide resin layer of the insulating resin layer, wherein a mixed region of the polyimide resin components is formed in the interface between the low-linear expansion polyimide resin layer and the thermoplastic polyimide resin layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.