Method and apparatus for heat curing resin compounds
US5375187A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 12, 1993 |
| Grant date | Dec 20, 1994 |
| Priority date | — |
| Expiry date | Feb 12, 2013 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF27D2099/0026
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for heat-curing light-cured resins by means of placing the resin in an oven attachment coupled to a high intensity light source, such that heat generated by the light source raises the temperature within the oven attachment to at least 140.degree. C., and maintains the temperature above 140.degree. C. for at least 10 minutes. The oven attachment has a body fabricated from a rigid material having a relatively low thermal conductivity. The oven attachment is fashioned to fit over the light outlet of a conventional light source. The oven attachment is preferably held in place by the same mechanism that holds a light-curing "wand" to the light source. The light source is turned on for a heating period of approximately 15 minutes, causing the temperature within an oven chamber within the oven attachment to rise. Upon completion of the heating period, the light source is turned off and the heat-cured restoration may be removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.