Method of making connector for integrated circuit chips
US5376226A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 28, 1993 |
| Grant date | Dec 27, 1994 |
| Priority date | — |
| Expiry date | Jan 28, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49208
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A connector is disclosed for electrically coupling groups of contact points formed on a first and second electronic circuit chip. The connector is constructed by applying a layer of dielectric material to a planar electrically conductive base, lithographically printing a pattern onto the dielectric material, etching the pattern and creating a plurality of wells extending through the dielectric material and a matching plurality of cavities in the surface of the base, and electroplating the pattern and filling the wells with an electrically conductive electroplate material. The electroplate thereby forms a plurality of conductive members, each extending through the dielectric material. The base is then removed from the dielectric material, thereby forming a connector board having the conductive members extending therethrough for electrically coupling the first and second groups of contact points on the circuit chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.