Method of manufacturing a printed circuit board
US5376232A · kind A · utility
4Cited by
42References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 23, 1993 |
| Grant date | Dec 27, 1994 |
| Priority date | — |
| Expiry date | Aug 23, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0344
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of depositing a conductive material on a surface of a printed circuit board, includes the steps of chemically treating at least a portion of a surface of the printed circuit board, disposing a resist layer over the chemically treated surface, depositing a conductive layer in the areas which are not covered by the resist, stripping the resist from the surface of the printed circuit board, and cleaning exposed chemically treated surfaces of the printed circuit board to remove contaminants from the surface of the printed circuit board which were introduced in the chemically treating step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.