Process for etching titanium at a controllable rate
US5376236A · kind A · utility
18Cited by
8References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 1993 |
| Grant date | Dec 27, 1994 |
| Priority date | — |
| Expiry date | Oct 29, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23F1/26
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process for removing titanium from a device is disclosed. The titanium is etched at a controllable rate. The etchant oxidizes the titanium, and the oxidized titanium forms a complex in the etchant. When the concentration of this complex in the etchant nears its solubility limit, it precipitates and forms a film on the titanium metal surface. This film reduces the rate of the etch, enabling the amount of titanium removed by the etchant to be controlled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.