Methods for making multilayer printed circuit boards
US5376326A · kind A · utility
34Cited by
105References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 23, 1989 |
| Grant date | Dec 27, 1994 |
| Priority date | — |
| Expiry date | Aug 23, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24074
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for making a multilayered printed circuit board including the steps of arranging two plates in spaced relation, arranging a perimetral seal between the two plates with an upper opening in the seal to form an upwardly open chamber, placing a plurality of printed circuit boards between the plates in spaced relation to one another, placing the chamber under vacuum, injecting a settable matrix material into the chamber, compressing the end plates towards one another to achieve the desired outer dimensions of the board, and curing the settable matrix material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.