Epoxy resin compounds in admixture with glycidyl phosphorus compounds and heterocyclic polyamines

US5376453A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Wolfgang von Gentzkow · Kleinsendelbach, DE
• Wolfgang Rogler · Erlangen, DE
• Dieter Wilhelm · Neu-Anspach, DE
• Juergen Huber · Erlangen, DE

Key dates

• Filing date: Mar 19, 1993
• Grant date: Dec 27, 1994
• Expiry date: Mar 19, 2013

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31525
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

The invention provides epoxy resin compounds for manufacturing prepregs and composite materials, which can be obtained inexpensively and have good processibility, and provide--without having to add flameproofing agents--virtually inflammable molded materials with a high glass transition temperature. The epoxy resin compounds contain the following constituents: PA1 (A) an aromatic and/or heterocyclic polyepoxide resin that is free of phosphorous, optionally in a mixture with an aliphatic epoxy resin; PA1 (B) an epoxy-group-containing phosphorous compound and PA1 (C) an aromatic polyamine as a curing agent.