Method of fabricating similar indexed dissociated chips
US5376589A · kind A · utility
6Cited by
3References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 3, 1993 |
| Grant date | Dec 27, 1994 |
| Priority date | — |
| Expiry date | Jun 3, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/975
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Similar semiconductor chips (12-15), which are produced together on a plate and subsequently dissociated, are provided with identifying markings (17-20) containing their earlier position on the plate. If defects occur later in the dissociated chips, analyses can be made to determine whether defects occur with particular frequency in certain regions of the plate, or whether a statistical distribution exists.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.