Process and device for machining workpieces by means of a laser beam

US5376770A · kind A · utility

Assignee

• Maho, LLC · DE

Inventors

• Michael Kuhl · Hafenhofen, DE
• Alfred Zwick · Marktoberdorf, DE
• Gunter Eberl · Waltenhofen, DE

Key dates

• Filing date: Jan 13, 1993
• Grant date: Dec 27, 1994
• Expiry date: Jan 13, 2013

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B23K26/364
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A process for precision control of a laser beam for machining workpieces while achieving high surface quality. The actual distance between a reference location and the workpiece surface is determined. A setpoint/actual value deviation between a predetermined setpoint distance and the actual distance measured is also determined. Control parameters are determined by a control unit in accordance with the setpoint/actual value deviation. The resulting control parameter outputs are coupled to a laser control unit to control the beam power of the laser. The disclosure also includes the apparatus for accomplishing the process.