Receiving device with separate substrate surface
US5376942A · kind A · utility
33Cited by
6References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 12, 1992 |
| Grant date | Dec 27, 1994 |
| Priority date | — |
| Expiry date | Aug 12, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q21/0093
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A plane antenna 2 and a receiving circuit 5 are formed on one and the same semiconductor substrate 1. Both can be connected by a microstrip line 7, and so on. Resultantly the receiving device as a whole can be small-sized and light. Furthermore, the plane antenna, the receiving circuit, and the microstrip line can be integrated by the common IC process, and the fabrication cost can be drastically reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.