Apparatus mounting a power semiconductor to a heat sink
US5377078A · kind A · utility
5Cited by
6References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 26, 1993 |
| Grant date | Dec 27, 1994 |
| Priority date | — |
| Expiry date | Jan 26, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and a method of mounting a power semiconductor (10) to an external heat sink (18) when both fastening faces (11, 13) of the semiconductor are inaccessible during the assembly process. The apparatus comprises a nut plate (20) that mates with the semiconductor (10) and a thermally conductive layer (28) that engages the nut plate (20) and wraps around the semiconductor (10) in a captive manner. The external heat sink (18) threadably engages the nut plate (20) without the need to access either fastening face (11, 13) of the semiconductor (10).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.