Radiation sensitive adhesive composition and method of photoimagingsame
US5378298A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 1, 1993 |
| Grant date | Jan 3, 1995 |
| Priority date | — |
| Expiry date | Jun 1, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of photodelineating an adhesive on a substrate. The first step (10) is to coat the substrate with a layer of photopolymeric adhesive, typically spin coated. The adhesive is then briefly `soft baked` at a moderate temperature to set it (20). Portions of the adhesive are then selectively exposed to actinic radiation to partially cure them, while other portions are not exposed (30). A photomask is used to selectively expose the photopolymeric adhesive to ultraviolet light at an intensity and for a time sufficient to partially cure the photopolymeric adhesive. The adhesive is developed (40) to selectively remove those portions that were not exposed to radiation, usually in an appropriate solvent, creating a pattern in the adhesive. The developed adhesive pattern is then heated for a time and temperature sufficient to completely cure it (50).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.