Method for producing substrates with passages
US5378314A · kind A · utility
8Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 15, 1993 |
| Grant date | Jan 3, 1995 |
| Priority date | — |
| Expiry date | Jun 15, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for producing aligned passages through substrate materials, in which the projection of the inlet and outlet openings does not coincide, uses displaced application of etching windows on opposite sides and corresponding pronounced under-etching of these windows. By applying displaced etching windows on both sides of the substrate and through-etching the substrate through these windows, `oblique` passages are obtained through the substrate. By a suitable location of the windows it is also possible to produce branched passages with more than one outlet opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.