Method for removing organic film
US5378317A · kind A · utility
36Cited by
6References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 23, 1993 |
| Grant date | Jan 3, 1995 |
| Priority date | — |
| Expiry date | Aug 23, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/98
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The method for removing organic film according to the present invention is very effective for removing a photo resist film in a process for manufacturing semiconductor device. A substrate (32) having a photo resist film (31) formed on it is processed in a wet processing tank (34) filled with a processing solution such as a mixed solution containing sulfuric acid and hydrogen peroxide or by a dry processing using oxygen plasma. Then, it is processed in an ozone processing tank (34) filled with a solution where ozone or ozone water has been infused, and the organic film is removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.