Patent · US Expired

Molding compositions containing a polycondensation product of a polyamide, a polyester and a compatibilizer

US5378769A · kind A · utility

8Cited by
2References
8Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 12, 1992
Grant dateJan 3, 1995
Priority date
Expiry dateAug 12, 2012

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L2666/28
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

A molding composition is provided which is effective as an agent for imparting compatibility in thermoplastic blends or as an adhesion-promoting layer in composite materials which comprises: PA0 A. a polyamide PA0 B. a polyester, and PA0 C. an oxazoline derivative.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.