Molding compositions containing a polycondensation product of a polyamide, a polyester and a compatibilizer
US5378769A · kind A · utility
8Cited by
2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 12, 1992 |
| Grant date | Jan 3, 1995 |
| Priority date | — |
| Expiry date | Aug 12, 2012 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/28
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A molding composition is provided which is effective as an agent for imparting compatibility in thermoplastic blends or as an adhesion-promoting layer in composite materials which comprises: PA0 A. a polyamide PA0 B. a polyester, and PA0 C. an oxazoline derivative.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.