Soldering apparatus with improved configuration of solder streams
US5379931A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 26, 1993 |
| Grant date | Jan 10, 1995 |
| Priority date | — |
| Expiry date | Aug 26, 2013 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K3/0653
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention relates to a soldering device comprising: a vessel opened at the top for filling with solder; at least two solder towers placed in the vessel, each adapted for delivering a flow of solder on their upper side; and a transporting member for carrying along the objects for soldering above the solder towers. In order to prevent, both in the case of soldering machines which operate in a normal atmosphere and those operating in an inert atmosphere, the solder flows falling back into the vessel from splashing solder up onto the underside of the printed circuit boards, the solder towers are adapted for generating jets directed toward each other, wherein the jets intersect before they make contact with the solder level prevalent in the vessel. According to a preferred embodiment the rear tower in the direction of movement forms a jet of solder comprising a movement component counter to the movement of the objects for soldering and enclosing an acute angle with the object for soldering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.