High density area array modular connector
US5380210A · kind A · utility
77Cited by
14References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 28, 1994 |
| Grant date | Jan 10, 1995 |
| Priority date | — |
| Expiry date | Mar 28, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/714
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A connector for electrically connecting circuit members having a high density of contact pads located in an area array, the connector having an area array specific holder that is simple to produce for retainably positioning mass-produced standardized contact modules containing a deformable contact within a module body for interconnecting the contact pads, where the contact is constructed to be supportingly engaged by the module body to provide sufficient opposing spring force to effect a wiping interconnection between the contact and the contact pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.