High modulus fiber protective carrier systems and methods for their use
US5380576A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 21, 1993 |
| Grant date | Jan 10, 1995 |
| Priority date | — |
| Expiry date | Jan 21, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31786
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A composite pre-slit tape useful as a protective carrier system for storing and handling high modulus fibers and processes for protecting such fibers are disclosed. An exemplary composite pre-slit tape includes a plurality of generally elongated and collimated pre-slit laminates oriented in a single plane and releasably bonded to a removable continuous backing layer which is in the form of a long thin tape. Each pre-slit laminate includes an adhesive layer located adjacent the continuous backing layer and a fiber supporting layer located adjacent the adhesive layer. In use as a fiber protective carrier, each pre-slit laminate is bonded to a fiber bundle of a plurality of collimated fibers arranged in a single layer. Each fiber is bonded along its length to the supporting layer of the pre-slit laminate. The combination of secured fibers and pre-slit laminate can be fed directly to a loom for forming woven fabric.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.