Hermetic semiconductor device having jumper leads
US5381039A · kind A · utility
84Cited by
12References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 6, 1994 |
| Grant date | Jan 10, 1995 |
| Priority date | — |
| Expiry date | May 6, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20752
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fine-pitch hermetic device (10) can be manufactured wherein two sets of wire bonds (18 & 20) are used to electrically connect a semiconductor die (12) to a leadframe (16). Jumper leads or conductive pads (28) are placed on an inner surface of a ceramic base (14) to electrically interconnect the two sets of wire bonds. The jumper leads enables shorter wire lengths to be used. The leadframe is attached to the ceramic base with glass embed technology. A cap (22) is affixed to the base with a hermetic seal (24). The invention is also compatible with flip-chip dice and multichip modules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.