Monolithic microwave integrated circuit receiving device having a space between antenna element and substrate
US5381157A · kind A · utility
75Cited by
6References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 28, 1992 |
| Grant date | Jan 10, 1995 |
| Priority date | — |
| Expiry date | Apr 28, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q21/065
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
The receiving device according to this invention includes one or more patch or helical antennas and one or more receiving units formed monolithically on a single substrate. In order to widen the receiving frequency band, antenna elements are formed not directly on a compound semiconductor substrate but with a space between the antenna element and the substrate. In the patch antenna embodiment, patch elements are supported by dielectric posts, whereby there is provided a void between most of the patch antenna and the underlying semiconductor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.