Liquid crystal polymer encapsulated electronic devices and methods of making the same
US5381599A · kind A · utility
13Cited by
17References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 12, 1993 |
| Grant date | Jan 17, 1995 |
| Priority date | — |
| Expiry date | Apr 12, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49172
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a high temperature, high pressure process of encapsulating electronic devices. The high pressure process is particularly suitable for encapsulating flip-chip devices wherein the collapse of flip-chip solder bumps is prevented. A special mold may be used to prevent the ceramic substrate of the flip-chip device from breaking under the high injection pressure conditions. The encapsulant is a rigid liquid crystal polymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.