Heat sink and the producing method thereof
US5381859A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 7, 1993 |
| Grant date | Jan 17, 1995 |
| Priority date | — |
| Expiry date | Jun 7, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat sink according to the invention comprises a multilayered body prepared by laying one upon the other a plurality of heat sink fin elements having pin-fin sections formed by cutting a number of slits through thin plates of a thermally conductive material with spacers, each being inserted between two adjacent heat sink fin elements to separate them by a given distance. The method of preparing a heat sink comprises steps of preparing heat sink fin elements by forming a number of slits and a surrounding marginal frame area in each of a first set of thermally conductive thin plates, preparing spacers by cutting out a central area of and forming a surrounding marginal frame area in each of a second set of thermally conductive thin plates having a shape same as that of the first set of thin plates, laying said heat sink fin elements and said spacers alternately one upon the other and bonding said assembled heat sink fin elements and spacers together at the outer surface or contacted areas to form a multilayered body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.