Soldering flux
US5382299A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 28, 1994 |
| Grant date | Jan 17, 1995 |
| Priority date | — |
| Expiry date | Jan 28, 2014 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/3615
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A soldering flux composition includes an aqueous solution containing as component (A) a compound selected from (i) hydrohalides and hydrophosphates of guanidine and substituted guanidines, (ii) hydrohalides and hydrophosphates of a five-membered nitrogen containing heterocyclic amine of the formula EQU C.sub.x N.sub.y H.sub.3 in which x is 1 or 2 and y is 4 or 5, and mixtures of (i) and (ii) and as component (B) at least one compound selected from hydrohalides and hydrophosphates of aliphatic amines selected from aliphatic monoamines of formula CH.sub.3 (CH.sub.2).sub.n NR.sub.2 and aliphatic diamines of formula R.sub.2 N(CH.sub.2).sub.m NR.sub.2 in which n is 0 to 10, m is 5 to 10 and R is hydrogen, methyl, ethyl, propyl or butyl, the components (A) and (B) being present in the relative proportions of 25 to 100% by weight of (A) and 75 to 0% of (B).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.