Method of selectively applying a coating to a bilevel substrate
US5382317A · kind A · utility
5Cited by
9References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 18, 1994 |
| Grant date | Jan 17, 1995 |
| Priority date | — |
| Expiry date | Feb 18, 2014 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D7/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of selectively applying a coating to either the upper or lower surface of a bilevel substrate. The method includes the steps of applying a layer of photoresist over the substrate and moving a doctor blade across the substrate, thereby removing the photoresist from the upper surface while leaving it on the lower surface. The photoresist is then hardened by drying and/or curing. The photoresist is then used to facilitate removal of the coating from either the upper or lower surface of the bilevel substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.