Process for producing copper clad laminate
US5382333A · kind A · utility
72Cited by
6References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 1992 |
| Grant date | Jan 17, 1995 |
| Priority date | — |
| Expiry date | Sep 24, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1157
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for producing a copper-clad laminate using a copper foil obtained by subjecting the surface of the copper foil to chemical oxidation thereby to form, on the surface, a fine roughness constituted by a copper oxide of a brown to black color and then reducing the copper oxide constituting the fine roughness in an atmosphere in which a reducing gas is present.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.