Method of making a laminated structure with shear force delamination resistance
US5382505A · kind A · utility
22Cited by
8References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 20, 1992 |
| Grant date | Jan 17, 1995 |
| Priority date | — |
| Expiry date | Mar 20, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0723
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The surface of a metal foil to be used as an intermediate layer in printed circuit boards is chemically roughened. In one embodiment, fine depressions are etched out of the metal coating. In another embodiment, protuberances are plated thereon. The use of the method permits the use of the foil in the production of multilayer printed circuit boards with coatings having different thermal expansion characteristics and improves the adhesion with the next conductor layer applied thereto to a significant extent and prevents delamination.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.