Semiconductor module with multi-plane conductive path

US5382830A · kind A · utility

Inventors

• Altan Akyurek · Achern, DE
• Peter Maier · Rielasingen-Worblingen, DE
• Jurgen Schulz-Harder · Achern, DE

Key dates

• Filing date: Dec 18, 1991
• Grant date: Jan 17, 1995
• Expiry date: Dec 18, 2011

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2203/302
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

For the manufacture of a power semiconductor module, one proceeds from a ceramic base board on which copper plates and copper conductor paths are fastened by a suitable method. The ceramic base plate is then scratched and broken. As a result, ceramic side boards are produced which are connected to the base board via conductive paths. The side boards are then swung up, as a result of which the conductive paths fastened on the side boards come into a plane above the base plane. By means of suitable, possibly multiple, breaking and folding of the side boards and suitable development of the ends of the conductive paths, the connecting poles of the power semiconductor chips can be directly contacted. Electronic circuits can be arranged on the side boards.