Hybrid coupler
US5382925A · kind A · utility
30Cited by
2References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 1993 |
| Grant date | Jan 17, 1995 |
| Priority date | — |
| Expiry date | Sep 9, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H1/00
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A plurality of inductors and a plurality of capacitors are formed as conductor patterns (3-1 to 3-4, to 4-8, 5) on dielectric layers (1-1 to 1-6) constituting a multi-layer wiring board. A set of circuit elements (inductors and capacitors) required to have the same inductance or capacitance value are formed on the common layers of the multi-layer wiring board. Thus, the circuit elements required to have the same value in the multi-layer wiring board can be manufactured under the same condition (the baking condition for example), so that the variations of the elements can be reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.