Sputtering apparatus
US5384021A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 10, 1993 |
| Grant date | Jan 24, 1995 |
| Priority date | — |
| Expiry date | Aug 10, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3405
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Apparatus for sputtering coatings of material onto a substrate from a chamber subject to substantial evacuation during use, which includes: a substantially cylindrical target tube having on a surface thereof the material to be sputtered, means for rotating the target tube about its longitudinal axis, magnetic means for assisting the sputtering process by the provision of a magnetic field in a sputtering zone associated with the target tube, means for moving the substrate through the chamber and into the sputtering zone, means for introducing an ionisable gas and a reactive gas into the chamber in the vicinity of the sputtering zone, wherein supplementary magnetic means are provided to form a supplementary magnetic field remote from the sputtering zone and means are provided to introduce ionisable gas in the vicinity of the supplementary magnetic field.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.