Resistive film-forming composition and electronic components using the same
US5384076A · kind A · utility
6Cited by
2References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 3, 1992 |
| Grant date | Jan 24, 1995 |
| Priority date | — |
| Expiry date | Mar 3, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01C1/02
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A resistive film-forming composition to be coated on a substrate and calcined to form a resistive film is disclosed, which contains an organic iridium compound selected from a compound represented by formula (I): ##STR1## wherein R.sup.1 represents a hydrogen atom, an alkyl group, or an alkoxy group, a compound represented by formula (II): EQU Ir(R.sup.4 COCR.sup.3 COR.sup.5).sub.3 wherein R.sup.3 represents a hydrogen atom or an alkyl group; and R.sup.4 and R.sup.5 each represent an alkyl group. A uniform resistive film having excellent electrical characteristics can be formed with good adhesion to a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.