Monitoring electroless plating baths
US5384153A · kind A · utility
1Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 10, 1993 |
| Grant date | Jan 24, 1995 |
| Priority date | — |
| Expiry date | Mar 10, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/187
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed is a method of monitoring electroless plating solutions. The solutions are used to plate a light-transmitting medium. Measurements are made to determine the time it takes for light transmission through the medium to be reduced to a certain level. This measurement can be used to determine whether articles will be sufficiently plated by the solutions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.