Compositions containing hollow microspheres
US5384345A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 20, 1993 |
| Grant date | Jan 24, 1995 |
| Priority date | — |
| Expiry date | Jul 20, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A composition is described with comprises a mixture of PA1 (A) from about 5% to about 60% by weight of at least one water-insoluble polymer; PA1 (B) from about 1% to about 30% by weight of inorganic or synthetic resinous hollow microspheres; and PA1 (C) from about 20% to about 85% of at least one volatile organic liquid which is a solvent for the polymer of (A). The compositions also may contain (D) at least one solid particulate inorganic filler. Adhesive compositions such as solvent cements prepared in accordance with the present invention are characterized as low VOC compositions wherein the VOC is, for example, less than 500 or even less than 400 grams per liter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.